BA4580YFVM-MGTR
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BA4580YFVM-MGTR is sourceable through our global supplier network. Submit an RFQ for price and lead time.
Previously available
| Manufacturer | Qty | Price / pcs | Lead time | Date code | |
|---|---|---|---|---|---|
| Rohm Semiconductor | 4,000 | Clients only | 7d | 25+ | |
| Rohm Semiconductor | 4,000 | Clients only | 7d | 23+ | |
| Rohm Semiconductor | 4,000 | Clients only | 2w | 22+ | |
| Rohm Semiconductor | 4,000 | Clients only | 2w | 22+ | |
| Rohm Semiconductor | 2,000 | Clients only | 2w | 22+ | |
| Rohm Semiconductor | 4,000 | Clients only | 7d | 22+ | |
| Rohm Semiconductor | 4,000 | Clients only | 3w | 21+ | |
| Rohm Semiconductor | 2,000 | Clients only | 3w | 21+ | |
| Rohm Semiconductor | 4,000 | Clients only | 7d | 22+ | |
| Rohm Semiconductor | 4,000 | Clients only | 7d | 22+ | |
| Rohm Semiconductor | 4,000 | Clients only | 7d | 21+ | |
| Rohm Semiconductor | 2,000 | Clients only | 7d | 21+ |
The BA4580YFVM-MGTR is an integrated circuit component designed for audio and signal processing applications in industrial and consumer electronics. This part belongs to a family of audio amplifier ICs that are widely used in compact audio systems, portable devices, and embedded audio solutions where space efficiency and integrated functionality are priorities.
The component is housed in a surface-mount package format, making it suitable for modern PCB assembly processes and high-density circuit board layouts. This package type allows for automated pick-and-place manufacturing and enables designers to minimize board real estate while maintaining reliable thermal and electrical connections.
The BA4580 series is typically employed in applications requiring low-power audio amplification, such as small speakers, audio warning systems, portable media players, and integrated audio outputs in industrial control panels and measurement equipment. The integrated design reduces the number of external components needed compared to discrete amplifier solutions, which simplifies circuit design and improves reliability through fewer solder joints and potential failure points.
Engineers might specify this exact part number when they require a proven, established audio IC solution with a well-documented pinout and application history. The part's availability through multiple channels and its use in established product lines make it a low-risk choice for designs that need to balance cost, performance, and time-to-market. The surface-mount package variant (YFVM designation) is particularly valuable in manufacturing environments already equipped for SMD assembly, as it eliminates the need for through-hole soldering and associated hand-assembly steps.
This component is suitable for applications where audio fidelity requirements are moderate and power consumption must remain minimal. Its compact integration makes it ideal for space-constrained designs such as embedded systems, IoT devices with audio feedback, and industrial equipment requiring audible alerts or notification functions.
The part's long-standing presence in the market means design resources, reference schematics, and application notes are readily available to engineering teams. This established track record reduces development risk and accelerates time-to-prototype compared to newer, less-proven alternatives.
For engineers evaluating this component, consideration should be given to the specific audio frequency response needed, the impedance of connected speakers or audio loads, and the available supply voltage in the target application. Compatibility with existing audio signal conditioning circuits and PCB layout requirements for audio circuits should also factor into the component selection process.
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